
Add to Cart
High Precession SMT Lead free JT Reflow Oven Single Rail JTR-800 Hot Air 8 Zone Reflow Soldering Machine
The Gento TJR-800 series is an eight-temperature hot air lead-free reflow soldering equipment designed for modern electronics manufacturing, for small and medium-sized production enterprises to provide efficient and stable welding solutions.
Precise temperature control and process guarantee
The equipment is equipped with eight independent temperature control zones, and each temperature zone is precisely adjusted by PID closed-loop control system, and the temperature control accuracy can reach ± 1 °C. The unique dual-turbine hot air circulation technology ensures that the transverse temperature difference of the PCB board is controlled within ± 2 degrees Celsius, which significantly improves the soldering consistency. For lead-free solder high temperature process requirements, the internal use of all stainless steel corrosion-resistant materials, support nitrogen protection matching function, can be reduced to less than 1000 ppm oxygen content, effectively reduce oxidation defects. The cooling system combines water cooling and air cooling to accelerate the crystallization of solder joints and ensure the reliability of welding.
Design of high efficient and compact single guide rail
JTR-800 series body length optimization to 5520 mm, compared with traditional equipment to save nearly 30% of the production line space, especially suitable for workshop space limited enterprises. Single rail structure supports modular fast switching, can adapt to 400 mm to 450 mm width of the PCB board, servo motor-driven transmission system to achieve 300 mm to 2000 mm per minute stepless speed, taking into account the demand of flexible production.
Product Name | Product model |
Hot air reflow | JTR-800 |
Detailed Description | |
Dimensions | 5520 x 1430 x 1530mm |
Main body color | Corrugated white |
Net weight | Approx. 2400KG |
Exhaust volume | 10m3/min×2 channels |
Power supply | 5 lines 3 phases; 380V 50/60HZ; (□ O: 220V 50/60HZ) |
Power | Starting power 30KW, working power 9KW |
Heating time | About 25mins |
Temperature range | Room temperature -300°C |
PCB maximum width | 400mm (460mm optional) |
Component height | 30mm on board/25mm under board |
Transport direction | Left to right (□ O: right to left) |
Guide rail fixing method | Fixed front end (□ O: fixed back end) |
Guide rail height from the ground | 900±20 mm |
Transport speed | 300-2000mm/min |
Parameter storage | Can store a variety of production setting parameters and conditions |
Abnormal alarm | Ultra-high or ultra-low temperature alarm, sound and light |
Lubricant filling | Freely switch between automatic and manual modes |
Equipment Configuration | |
Number of heating/cooling zones | 8 upper and 8 lower heating zones, 3 upper/3 lower cooling zones |
Control system | WIN10+commercial computer+PLC |
Temperature control method | PID closed-loop control+SSR drive |
Temperature test line | 4 rails |
Transportation system | Single rail+mesh belt transport |
Transportation control method | Inverter+imported transport motor |
Chain structure | Double-row chain buckle anti-stuck plate type |
Guide rail structure | Overall segmented type |
Guide rail width adjustment | Electric width adjustment of rails |
Top cover start | Electric opening of the upper cover for easy cleaning of the furnace |
UPS power supply | Backup power supply |
Cooling method | Forced air cooling |
The equipment is suitable for FR4 substrate, aluminum substrate and ceramic substrate and other materials, widely used in consumer electronics, LED lighting modules, automotive electronic control units and industrial equipment circuit board production.