Shenzhen Hongxinteng Technology Co., Ltd.
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GKG GSE Printing Product Introduction
High-Precision Printing
Equipped with advanced vision systems and automatic stencil alignment, the GSE Solder Paste Printer ensures precise solder paste deposition, even for the most complex PCB designs.
Capable of handling fine-pitch components and miniature solder pads with unmatched accuracy.
User-Friendly Interface
Features an intuitive touchscreen interface for easy operation and quick setup.
Allows operators to monitor and adjust printing parameters in real-time for optimal results.
Robust and Durable Design
Built with high-quality materials and components to ensure long-lasting performance in demanding production environments.
Designed for low maintenance and high reliability, minimizing downtime and maximizing productivity.
Versatile and Flexible
Compatible with a wide range of stencil sizes and PCB thicknesses, making it suitable for diverse production needs.
Supports both leaded and lead-free solder pastes, catering to various industry requirements.
Advanced Cleaning System
Integrated automatic stencil cleaning system ensures consistent print quality by preventing solder paste buildup and contamination.
Reduces the need for manual intervention, improving efficiency and reducing waste.
High-Speed Performance
Capable of printing up to X boards per hour (adjust based on actual specifications), making it ideal for high-volume production lines.
Optimized for fast cycle times without compromising on precision or quality.
| Repeat PositionAccuracy | ±0.01mm |
| Print Accuracy | ±0.025mm |
| NCP-CT (Does not include cleaning and printing) | 7.5s |
| HCP-CT(Including cleaning and printing - 180*120mm) | 19s/pcs |
| Process CT | 5min |
| Transition CT | 3min |
| Substrate processing parameter | |
| Maximum board size | 400*340mm Expandable:530*340mm (option) |
| Minimum board size | 50*50mm |
| Board thickness | 0.4~6mm |
| Camera Mechanical range | 528*340mm |
| Maximum board weight | 3kg |
| Board edge clearance | 2.5mm |
| Board height | 15mm pin |
| Transport speed | 900±40mm |
| (Max)Transport speed | 1500mm/s (Max) |
| Transport direction | One stage |
| Transmission direction | Left to Right |
| Right to Left | |
| In and out the same | |
| Support System | Magnetic Pin |
| Support Block | |
| Manual Up-down table | |
| Board damp | Manual the top damping |
| Side clamping | |
| Printing Parameters | |
| Print Speed | 10~200mm/sec |
| Print Pressure | 0.5~10Kg |
| Print Mode | One/Twice |
| Queegee Type | Rubber/Squeegee Blade (angle 45/55/60) |
| Snap-off | 0~20mm |
| Snap-Speed | 0~20mm/sec |
| The template frame size | 470*370mm~737*737mm(厚度:20-40mm) |
| Steel mesh positioning method | Manual positioning |
| Cleaning Parameters | |
| Cleaning System | Dry,Wet Vacuum three modes |
| Cleaning system | Up Drip type |
| Cleaning stroke | Automatic generation |
| Cleaning position | Post cleaning |
| Cleaning Speed | 10-200mm/sec |
| Cleaning fluid consumption | Auto &Manually adjustable |
| Cleaning paper consumption | Auto &Manually adjustable |
| Vision Parameters | |
| CCD FOV | 10*8mm |
| Camera type | 130 Thousand CCD Digital camera |
| Camera System | Lock up/down optics structure |
| Camera Cycle time | 300ms |
| Fiducialmark types | Standard Fiducial Mark Shape |
| round,square,diamond,cross | |
| Pad and profile | |
| Mark size | 0.5-5mm |
| Mark number | Max:4pcs |
| Stay away number | Max:1pcs |
| Intelligent equipment | |
| Safety control | Open door stop, abnormal alarm |
| 2D detection | Detection of insufficient tin/missing printing/connected tin |
| Machine parameter | |
| Power Source | AC:220±10%,50/60Hz 2.2KW |
| Air Pressure | 4~6Kgf/cm2 |
| Air Consumption | 5L/min |
| Operating Temperature | -20℃~+45℃ |
| Working environment humidity | 30%~60% |
| Machine dimension (without Tower light) | 1460(H)mm |
| Machine Length | 1152(L)mm |
| Machine Width | 1362(W)mm |
| Machine Weight Approx | Approx: 900Kg |
| Equipment load bearing requirements | 650Kg/m |
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.