Shenzhen Hongxinteng Technology Co., Ltd.
Add to Cart
Semi automatic Wave Soldering High Quality PCB Lifting SMT Desktop DIP Spray Soldering Machine Auto Wave Solder Machine
DIP soldering method:
As long as the substrate with good flux is placed on the needle holder, and then step on the foot switch, multiple pieces of various substrates can be soldered at one time. The angles are all controlled by microcomputer, completely simulating the principle of manual dip soldering, no training is required for personnel, anyone can dip soldering operation without skilled hands, the welding quality is stable, and the production efficiency can be improved.
Function:
Suitable for circuit boards and general soldering products
Improve welding quality and imitate manual welding
Improve production efficiency, batch products can be welded at the same time, which is about 4 times higher than manual
| Parameter | |
| Model: | ZD4530DPF |
| Solder paste temperature: | 0-350℃ |
| Solder paste capacity: | 75KG |
| Power: | 4.5KW |
| Tin furnace tank size: | 450*300*75mm |
| Dial area: | 390*260*30mm |
| Overall size: | 1150*530*1350mm |
| 1. Introduction of spray: | |
| Inner tank specification: | 300*300*140mm |
| Nozzle model: | Danfoss |
| Drive form: | electric |
| 2. Technical parameters of spray furnace: | |
| Nozzle diameter: | 1.3mm |
| Water ejection volume: | 0-360ml/min |
| Air usage (continuous flat blowing): | 100l/min |
| Flat blow spray width: | 200mm height 200mm; 300mm height 320mm |
| Round blow width: | 70mm diameter at 200mm height; 80mm diameter at 300mm height |
| Atomized average particle size: | 100um |
| Air compressor: | 0.75-1.5KW |
| Maximum pressure volume: | 5kg/cm² |
| Distance from nozzle to product: | 20-30cm |
| Voltage | 220V |
| Weight: | 80KG |
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.