Shenzhen Hongxinteng Technology Co., Ltd.
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DIP Automatic Assembly Machines Line
A DIP Automatic Assembly Line is designed for efficiently assembling Dual In-line Package (DIP) components onto printed circuit boards (PCBs) through automated processes. A DIP Automatic Assembly Line integrates robotics, precision engineering, and quality control to achieve high-efficiency, high-reliability PCB assembly. By automating insertion, soldering, and inspection, it ensures consistent production while minimizing human error and labor costs.
Function: A DIP Plug-in Line is a specialized assembly system for inserting Dual In-line Package (DIP) components (e.g., ICs, connectors, resistors) into PCBs. It is optimized for manual or semi-automated workflows, offering flexibility for small to medium production batches.
Key Specifications:
- Single-Side Line: For inserting components on one side of the PCB.
- Double-Side Line: Allows simultaneous or sequential insertion on both PCB sides, increasing versatility for complex boards.
- Equipment Dimensions: L300 × W650 × H1700 mm (ideal for space-constrained factories).
- PCB Compatibility: Maximum PCB width of 350 mm, suitable for standard-sized boards.
- Transfer Speed: 0.5–2 meters/minute (adjustable to balance speed and operator workflow).
- Manual Width Adjustment: Operators can adapt the conveyor width to accommodate varying PCB sizes.
- Power: 60W, making it energy-efficient compared to fully automated lines.
Function: The SMART Plug-in AO1 Machine is a versatile AOI system optimized for medium-sized PCBs and larger components (≥5.0mm²). Its rapid setup and dual-camera options make it adaptable for high-mix SMT lines, though its minimum measurable size limits micro-component inspection. Throughput depends heavily on PCB complexity and FOV coverage, requiring careful balancing with upstream processes like SMT placement or reflow. For facilities prioritizing fast deployment and Linux-based control, this machine offers a cost-effective AOI solution, provided operators are trained in Ubuntu and inspection algorithm tuning.
Key Specifications:
Inspection Capabilities:
- Minimum Component Size: MEMS or features ≥5.0mm × 5.0mm (limited for very small components).
- Speed: 5 seconds per Field of View (FOV) → Throughput depends on PCB size and FOV coverage.
- Accuracy: 66µm (with 2000W camera at 300mm object distance).
Camera & Resolution:
- Options: 2000W full color (2.4µm pixel size) or 1200W full color (3.45µm pixel size).
- 2000W: Higher resolution for finer details (e.g., small traces, solder joints).
- 1200W: Faster processing for larger components or lower precision needs.
PCB Compatibility:
- Dimensions: Width ≤400mm, minimum length 50mm (supports small to medium boards).
System & Power:
- OS: Ubuntu 19.2 LTS 64-bit (requires Linux expertise).
- Power: 220V AC ±10%, max 350W (energy-efficient for AOI).
- Weight/Size: 140kg, 702 × 661 × 1440mm (compact for integration into SMT lines).
Setup Time:
- Programming: 10-minute quick start (ideal for high-mix, low-volume production).
- Function: This machine is designed for high-quality soldering of through-hole components on PCBs using lead-free solder, complying with environmental regulations (e.g., RoHS). Its dual-wave system ensures reliable solder joints for complex boards. This lead-free double wave soldering machine combines precision, compliance, and industrial durability for modern PCB assembly. Its dual-wave design, programmable controls, and compatibility with tall components make it ideal for high-mix, high-reliability manufacturing. For optimal performance, integrate it with flux applicators, preheaters, and inspection systems tailored to lead-free processes.
Key Specifications:
- Max PCB Dimensions: 350mm.
- Max components height: Top 120mm bottom15mm.
- Transfer PCB board Speed: 500-1800mm/min.
- Preheating length: 1800mm long.
- Power Supply: 3PH 380V, 50Hz.
- Control System: PC+PLC
- Machine weight: 1600KG
- Machine Dimensions: 4350mm × 1420mm × 1750mm (compact, space-efficient design).
The Wave Soldering Unloader is a post-soldering conveyor system designed to safely transfer PCBs from the wave soldering machine to downstream processes (e.g., cooling, inspection, or packaging). Its adjustable design and anti-static features ensure compatibility with diverse production environments.
Key Specifications
-Adjustable Height & Speed: Height Range (750–1200 mm) Aligns with wave soldering machines, inspection stations, or cooling racks.
- Speed Control: Matches the throughput of upstream soldering equipment (e.g., 1–1.8 m/min wave soldering machines).
- Anti-static belt minimizes electrostatic discharge risks, critical for sensitive ICs or high-reliability boards.
- Narrow width (490 mm) saves floor space, ideal for small to medium production lines.
- Flexible Conveyor Length: Configurable length (400–1200 mm) accommodates varying cooling or buffer zone requirements.
Post-reflow quality inspection and defect detection.
Optical System: 5MP high-resolution cameras with coaxial lighting, detecting 0201 component misalignment (≥15μm offset) and solder bridging (≥20μm).
Inspection Algorithms: Pre-programmed templates for common defects:
- Missing components.
- Testing element 0201 components, 0.3 mm pitch and above IC (optional can reach 01005 components).
- Insufficient solder on LED pads.
Data Integration: Ethernet connectivity for real-time defect mapping and integration with MES systems.
Industry-Specific Adaptations:
LED Lighting: Additional color analysis to identify incorrect LED binning (CCT deviations).
Appliance Safety: Polarity checks for capacitors and diodes to prevent reverse mounting in control boards.
This fully automated DIP line is suitable for DIP components production, industrial products, Consumer electronic, Mobile, Computers, and Automotive Industries.