Shenzhen Hongxinteng Technology Co., Ltd.
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| Technology Platform | Single lane Type-c Platform |
| Series | A Series |
| Model | A510 /A630 |
| Measurement Principle | Sine white projection PMP inspection |
| Measurements | Missing parts, offset, rotation, three-dimensional polarity, upside down, OCV , side standing, tombstone, poor soldering, etc. |
| Detection of Non-Performing Types | Solder tip, solder volume percentage, excessive solder, insufficientsolder, bridge, hole plugging, solder filet, pad contamination, etc. |
| Lens Resolution | 6.5M 13.5um/16.5um option；12M 12um/15um option |
| Accuracy XY (Resolution): | 10um |
| Repeatability | height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma); |
| Gage R&R | <<10% |
| Inspection Speed | 0.45 SEC/FOV |
| Quanlity of Inspection Head | 4piece |
| Mark-point Detection Time | 0.5sec/piece |
| Maximun Meauring Head | 10mm |
| Maximum height of element on PCB | 50mm |
| Maximun Measuring Height of PCB Warp | |
| Minimum element | 1005 |
| MaximunLoading PCB Size(X*Y) | 450x450mm (A510) |
| 600x550mm (A630) | |
| Conveyor Setup | front orbit (back orbit as option) |
| PCB Transfer Direction | Left to right or Right to left |
| Conveyor Width Adjustment | manual & automatic |
| Engineering Statistics SPC | :Production Trend；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repartability Data；AOI Daily/Weekly/Monthly Reports |
| Gerber & CAD Data Import | (support Gerber format(274x,274d),Artificial called the pattern, X/Yimport CAD) |
| Operating System Support | Windows 10 Professional (64 bit) |
| Equipment Diemension and Weight | W1000xD1174xH1550,985Kg |
| Optional | 1D /2 D Barcode Scanner; Badmark Function; three-point function; offline programming; Repair Station |
The programmable structure grating (PSLM) is developed and manufactured independently to form a full-spectrum structure grating. Compared with the traditional moiré gratings, the structure grating can be modulated and controlled by software The detection capability and application range of the equipment are greatly improved.
3D SMT AOI adopts innovative AI intelligent seamless jigsaw puzzle technology, which reaches the level of indiscernibility to the naked eye, and for the problems of uneven, uneven, uneven color and image distortion encountered at the joint between Fov and Fov of traditional Aoi, it improves the positioning accuracy of the detection box and reduces the debugging time of the program.
After intelligent seamless mosaic technology processing of the image, can not see uneven, uneven, uneven color, image distortion
3DAOI adopts the self-developed enhanced multi-angle, multi-area, adjustable RGB + w + coaxial 2D light source design, which is suitable for the detection of components, solder joints and text in various situations.
3DAOI adopts the method of intelligent program editing and the mode of template parameter setting, so it is convenient to write and debug programs quickly.
3DAOI adopts 3D localization technology and 2D localization technology as assistant to ensure accurate localization of Chip and IC components and PIN PIN and black components.
The 3D AOI camera uses the COAXPRES (SCXP-6) standard with a 1200W resolution and a frame rate of up to 188 frames to ensure industry-leading test speed. 3D AOI can achieve the best detection scheme by using the optional 4 projection heads + 8 projection heads and PSLM multi-frequency projection capability, covering all SMT applications.
3D AOI has a complete SPC analysis software and closed-loop control, to ensure that 3D AOI test data can be fully statistical and analytical, and can be easily traceable; 3DAOI three-point integration function, using Sinic-Tek's 3DSPI and 3DAOI, specific measurements of a single PAD can be queried.
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.