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Imaging System | Single track online machine-S510 | Double track online machine-S510D | Downward illumination onlinemachine-M300 | Double-sided photo online machine-M400 | |||
Camera | Standard:5megapixel industrial camera (optional:12 megapixel industrial camera) | Standard confquration:12 megapixel industial camera | |||||
Lenses | Telecentric lens | ||||||
Light source | RGB three-cdlor light | ||||||
Resolution | Standard:15um (optional 10um) | Standard:16um (optional 10um) | |||||
Field of wiew | 5 megapixel industrial camera:10um:24*20mm 15um:36*30mm 12 megapixel industrial camera:10um:40*30mm 16um:64*48mm | ||||||
Sports Platform | |||||||
Measurable board size | 420mm*350mm | Monorail transmission: 420mm*560mm Double track transmission: 420mm*310mm | 510mm*460mm | ||||
Plate thickness range | 0.3~5mm | ||||||
Cip width | 3mm | ||||||
Clear height | Factory standard: TOP: 30mm BOT: 30mm Maximum adjustable: TOP: 45mm BOT: 45mm | Factory standard: BOT:30mm Maximum adjustable: BOT:50mm | Factory standard: TOP:50mm BOT:30mm Maximum adjustable: TOP:50mm BOT:50mm | ||||
Maximum plate weight | 5KG | 7KG | |||||
Detection speed | 250~300ms/FOV | ||||||
X,Y movement | Servo Motor | ||||||
Equipment Specifications | |||||||
Operating system | Windows 1064bit | ||||||
Power supply | AC220V, 50/60Hz | ||||||
Air pressure | 0.5Mpa | ||||||
Track height | 900±20mm | 730±20mm (additional pads are possible) | |||||
Machine weight | About 60OKG | About 800KG | About 60OKG | About 730KG | |||
Machine size | L890*W990^H1560mm (wihout waming light) | L890*W1380*H1560mm (without waming light) | L990*W1400*H1700mm (wathout weaming light) | L990*W1400*H1700mm (wihout waming light) | |||
Test items | |||||||
SMT testing items | Wrong parts, missing parts, reverse, offset, erected, sideways, flipped, damaged, short circuit | ||||||
Insuffident tin, cokd sokder joint, empty sokder joint, glue overflow, copper exposure, pin lif, pin defomation | |||||||
THT test items | No tin, toolite tin, too much tin, vods, short crcuits, exposed coper, talse sodering, buned feet, tin bals, forelgn matter |
Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.