Shenzhen Hongxinteng Technology Co., Ltd.
Add to Cart
Ideal for Precision Screen Printing on Various Rigid PCBs: Circuits, Soldermask, Green Ink, and TextAvailable in both fully automatic and semi-automatic models, this system features a robust vertical alloy frame. The motor, combined with precision rails, ensures smooth vertical movement, providing exceptional stability and a long service life with minimal maintenance.
The squeegee assembly is controlled by an independent constant pressure air cylinder group, while the high-hardness tabletop is equipped with evenly distributed air holes for fast, stable printing speeds. It can also be equipped with a docking station and conveyor belt for enhanced automation.
| Machine Name | Auto PCB Circuit Silk Screen Printing Machine | Semi-automatic PCB Circuit Silk Screen Printing Machine | ||
| Machine Model | MDS-7050 | MDS-1250 | MDS-1260 | MDS-1250-B |
| Print Area | Maximum Print Area: 700mm*400mm Minimum Print Area: 350mm*200mm |
Maximum Print Area: 1250mm*500mm Minimum Print Area: 350mm*200mm |
Maximum Print Area:1250mm*600mm Minimum Print Area:400mm*250mm | Maximum Print Area: 1250mm*500mm Minimum Print Area: 350mm*200mm |
| Maximum Frame Size | 1200mm*930mm | 1700mm*1050mm | 1700mm*1050mm | 1700mm*1050mm |
| Printing Table Size | 1000mm*750mm | 1500mm*900mm | 1500mm*750mm | 1500mm*700mm |
| Print Speed | 580 pieces per hour (Depending on the complexity of the circuit) | 450 pieces per hour (Depending on the complexity of the circuit) | / | |
| Print Thickness | 0.8-3.0mm | 0.6-3.0mm | ||
| High Of Wipe Mesh | 300mm | |||
| Feeding Direction | Left in, right out / Right in, left out (customizable) | |||
| Security Measures | Through-beam light grating + Self-locking air valve | |||
| Loading and Unloading Method | Automatic loading and unloading | Manual loading and unloading | ||
| Operation System | PLC system for easy operation | |||
| Power Supply | Three-phase five-wire AC380V 5.5KW | Three-phase five-wire AC380V 4.0KW | ||
| Air Supply | 0.5MPA-0.7MPA | |||
| Machine Dimension(L*W*H) | 3500*1320*1750mm | 4900*1400*1750mm | 4900*1500*1750mm | 2200*1400*1750mm |
| Machine Weight | 900KG | 1000KG | 1100KG | 800KG |
Compatible with various solder mask inks, printing inks, conductive inks, shielding inks, protective inks, thermosetting inks, and photo-sensitive inks for printing.
1. Robust, Durable Integrated Frame: The machine base is designed for durability, with a motor-driven, precision rail system for stable vertical movement of the stencil frame. The powerful transmission structure ensures high precision and stability.
2. Separate Precision Pressure Control for Squeegee and Doctor Blade: The squeegee and doctor blade feature a separate precision pressure control system, allowing flexible adjustments of ink pressure and angle.
3. Printing Platform Flatness of ±0.08mm: The platform is made from a single-piece cast aluminum, ensuring excellent flatness and uniform ink application for consistently high-quality printing results.
1. Three Operation Modes for Flexibility: The fully automatic circuit printer offers three operation modes: automatic, semi-automatic, and manual. Choose the most suitable printing mode based on production requirements for greater flexibility.
2. User-Friendly PLC Touchscreen Control: Easy-to-use PLC touchscreen operation ensures quick learning and smooth workflow. Equipped with multiple safety features, including safety light curtains and emergency stop buttons, to ensure operator safety.
1. High-Volume Manufacturing
Automatic Machines: Ideal for mass production, utilizing CNC technology for continuous, efficient operation with minimal human oversight. They excel in environments requiring consistent output and high throughput.
Semi-Automatic Machines: Suitable for moderate batches, offering flexibility for occasional design changes without full automation costs.
2. Precision and Complexity
Automatic: Ensure micron-level accuracy for multi-layer PCBs and micro-vias, critical in advanced electronics like smartphones and medical devices.
Semi-Automatic: Provide adequate precision for simpler designs but may require manual adjustments for complex layouts.
3. Multi-Layer and HDI Boards
Automatic: Adjust drilling depth dynamically for layer-to-layer connections (blind/buried vias), essential in high-density interconnect (HDI) designs.
Semi-Automatic: Require operator input for layer-specific parameters, limiting scalability for intricate multi-layer projects.
4. Flexible and Rigid-Flex PCBs
Automatic: Use specialized drill bits and adaptive speed control to handle delicate flexible materials without damage.
Semi-Automatic: Depend on operator expertise to adjust settings, posing challenges for consistency in flex circuits.